How to customize a PCB ?

As a customer of PCB industry, you may often ask: How can I customize a PCB board? Why can’t the PCB manufacturer ( or PCBA manufacturer ) follow my requirements?

Actually, you should ask yourself first: Have I got a design document?

Well, to customize a PCB board, you need to offer a design document first which is called a “Gerber file”, it is used to describe your requirements for the PCB board you’d like to customize.

What will be contained in a Gerber file?

① Layer count
② Delivery size
③ Surface finished (such as: HASL, ENIG)
④ Material (such as: FR1, FR4,FR2, CEM-1)
⑤ Board thickness
⑥ Copper thickness
⑦ Solder mask

Items above, they make it each other possible. Otherwise, it may cost engineering problems.

Is it absolutely necessary to have a Gerber file?

Fortunately, it is not if you happened to have a sample PCB board and want a large number of that. You simply send the sample PCB board to the PCB manufacturer works for you, and then all you need to do is enjoying a short wait until the PCB manufacturer send back a host of PCBs, each one of which is the same as the one you send to them.

For PCBA, a BOM list ( BOM-Bill of material ) is necessary during customization.

Pay attention that you should make sure the list providing as many details as possible about the used materials. Otherwise, it may cost engineering problems.

In conclusion, if you want to customize a PCB board or get some PCBA services, you need to find a high quality, experienced PCB manufacturer or PCBA manufacturer and offer your Gerber file, sample PCB board, or BOM list as your requirements.

WONDERFULPCB.COM

The deep BAF process for PCB waste water (3)

3.2 BAF impact on the rest of the water quality indicators

3.2.1 wastewater pH changes

raw water after the factory original coagulation precipitation process preliminary treatment, when entering the BAF system average pH 9.0, basic on the verge of overweight and direct emissions may be the cause of river pollution, soil alkalization, etc. Using BAF process, due to the microbial nitrification system consumes basicity (mainly NH4 +) in waste water, the water pH basic remain at around 7.9, standard ensures water at any time.

3.2.2 the change of ammonia nitrogen in wastewater

Wastewater after treated with BAF system declined, of ammonia nitrogen in water by 19.86 mg/L fell to 13.89 mg/L, but has yet to reach discharge standards, this is due to the best of nitrifying bacteria, proliferation and survival temperature is 25 ℃, while during the experiment system in a row after the water temperature maintained in 11 ~ 16 ℃, under the temperature of BAF in the growth and activity of nitrifying bacteria is restrained, resulting in poor ammonia nitrogen removal efficiency.

3.2.3 waste water in copper complexing state changes

The copper ammonia wastewater mainly complex ion (Cu (NH3) 2 + 4) exist, Cu2 + is very little.BAF role to eliminate the Cu complex in from [Cu (NH3) 2 + 4) isolated Cu2 +, OH - from their response to that of the wastewater generated Cu (OH) 2 precipitate, which was BAF biological flocculation adsorption.

BAF process in the wastewater Cu complexing state overall declining (1.40 mg/L to 0.82 mg/L), but the water was not up to standard. This is because the BAF nitrification and the Cu (OH) 2 is the best temperature flocculation adsorption 20 ~ 30 ℃, and the system straight into the water after the water temperature maintained at 11 ~ 16 ℃, seriously inhibit the adsorption of biofilm activity, lead to the removal of Cu effect is not very ideal.

4. Conclusion

(1) using the depth of the BAF process a printed circuit board factory PCB wastewater treatment, when the water COD load of 0.12 kg/(m3 · d), average inlet COD is 187.8 mg/L, the process average effluent COD can be dropped to 41.8 mg/L; When water COD load up to 0.36 kg/(m3 · d), the average COD water can also fell to 42.1 mg/L, fully meet the local relatively strict wastewater discharge standard requirements.

(2) Because the backwash water quality to suit the requirements of discharge standards, emissions should be to adjust the pool to processing. Backwash cycle is about 15 d.



(3) During the experiment temperature is 11 ~ 16 ℃, BAF in the growth and activity of nitrifying bacteria is restrained, flocculation adsorption activity of the biofilm, ammonia nitrogen and complexing state Cu removal effect is not very ideal. Need to consider to take corresponding measures to improve the filter water temperature or appropriate to ammonia nitrogen in water and Cu for further processing.

Aluminum board process-B

5.4 board inspection
5.4.1 line surface must be in accordance with the requirements of the MI to check all the content.
5.4.2 must check on aluminum surface, aluminum surface dry film cannot have film falls and broken.
5.5 etching
5.5.1 for copper base is commonly 4 oz, will there is a certain difficulty in etching.First plate must be approved by the captain in person to do board, made in the spot check, line width, line spacing should be strengthened once every 10 PNL plate spot check line width, and make records.
5.5.2 recommended parameters: speed: 7 ~ 11 dm/min pressure: 2.5 kg/cm2 proportion: 25 be temperature: 55 ℃ (the above parameters are for reference only, the test plate results shall prevail)
5.5.3 back membrane should be paid attention to the time of the control between 4 ~ 6 min, because aluminium will reaction with NaOH, but also must ensure that the membrane clean, backing down membrane liquid membrane was not allowed to turn up the heat.No protective film of the plate, aluminum, from liquid membrane in the back up after the board will not stay to wash water on a board in time of liquid membrane, prevent the alkali corrosion of aluminum pcb surface.  
5.6 corrosion inspection
5.6.1 normal board.
5.6.2 it is forbidden to use the blade repair line, in order to avoid injury and dielectric layer.
5.7 the solder mask
5.7.1 production process:
Brush copper surface grinding plate (only) to screen printing green oil (the first), and preliminary drying screen printing green oil (second) and the preliminary drying - exposure and development - plate mill, the acid pickling process. Under the soft brush - after curing -
5.7.2 reference parameters:
5.7.2.1 yarn used 36 t + 100 t
First 75 ℃ 5.7.2.2 x 20-30 min;The second 75 ℃ x 20-30 min
5.7.2.3 exposure: 60/65 (single) 9 ~ 11
5.7.2.4 enhancement: speed: 1.6 ~ 1.8 m/min pressure: 3.0 kg/m2 (total pressure)
5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.   
5.8 HASL
5.8.1 spray before tin for aluminum plate with protective film tear protective film after spray tin.    
5.8.2 edge with both hands, it is strictly prohibited by hand directly touch the plate (especially aluminum surface).
5.8.3 operation, fight chafed.
5.8.4 tin cookie sheet before 130 ℃, 1 hour, and baking sheet to spray tin interval time less than 10 minutes.In order to avoid temperature difference cause a layered with ink.    
5.8.5 rework plate spray is only allowed to return once, if more than one board, to distinguish for special treatment.    
5.9 aluminum surface passivation treatment
5.9.1 level passivation process: (1) scrubbing brush (500 #) to (2) water - > (3) passivation, (4) washing the x 3-5. Dry - 6 drying
Note: (1) grinding plate: only aluminum surface grinding, FR4 parameter grinding plate.First board to check line no scratches, as well as the tin cried, uniform grinding crack.
(3)passivation: potion ingredients open cylinder quantity cylinder volume liquid temperature control concentration spraying in tank pressurization rate
Na2CO3 (CP) 50 g / 6500 g l, 130 l, 40 ~ 50 ℃ 2.0 ~ 3.0 1.0 ~ 1.5 m/min effective soaking time 10 ~ 15 s 100 m2 CP (K2CrO4) 15 g/l,  1950 g NaOH (CP) 390 g, 3 g/l
6 drying: 80 ~ 90 ℃.
Tyle = "the oledata.mso - spacerun: 'yes', the font size: 10.5000 pt; the font-family:" tahoma "; "> 5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.   
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.  

OEM PCB and PCBA----Wonderful PCB(hk)Limited

Total product solution often requires Flexible pcb production and assembly which we offer our clients. Among the different types of OEM products we produce are complete /partial turnkey manufacturing including BOM building+ Material procurement and management assurance.

In the PCBA lines we have the most advanced machinery that include Lead-Free Capability, BGA SMT placement, Conventional ‘thru-hole’ PCB assembly. For the testing we offer In-Circuit Test, Analogue/ Digital functional test equipment, Customized testing programs and fixtures.
Wonderful PCB well trained engineering stuff will be happy to learn your needs and reply accordingly just let us know -we can assure you will be satisfied from the results...
Printed circuit board is wide application in all kinds of electronic products. The aluminum PCB is use LED light.
Wonderful PCB is professional manufacturer of high quality PCB&PCBA with competitive price and attractive lead time.
NO MOQ:
We supply PCB Prototype & Mass production with good price and high quality.              

All the PCB is reaching IPC II Standard.                                         
In as much as Wonderful PCB has no control over the use to which others may put the material, each user of the material is not released of making his own tests to determine the material’s suitability for his own particular use. Statements concerning possible or suggested uses of the materials described herein are not be construed as constituting a license under any Wonderful PCB patent application covering such use or as recommendations for use of such materials in the infringement of any patent.
Lamination assist had Kraft press pad, silicon rubber press pad, Teflon release film, pressure revealing films. With the description of provide uniform cushioning and precise control over heat rise and long life (up to 150 uses) and faster lay-up. Put talcum powder before use.

Our pressure revealing film is a unique analytical tool. Provides a quick, easy and accurate in-house procedure for checking for “high” and “low” pressure zones due to press platen misalignments or the design configuration (pads, high density circuitry, ground planes, etc.) of the circuit board itself

PCB, CCL application CQC authentication problem solving----Wonderful PCB (hk) Limited

1, why the CQC reference standard or s very long?
A: for CQC application standard, we search the IEC standard, is not the latest version of PCB in national standard is equal to the IEC standard, release s mostly in 1990 and 1991.
2, after the official launch of the new standards, CQC will update?
A: yes, according to the national standard committee of planning, will officially issued the new standard by the end of the year. At the appointed time, cQc will also be revised according to the new standard.
3, PCB in the process of application CQC, is there a required for base material certification?
Answer: in terms of certification: PCB when applying for CQC certification, the base material of the CQC certification or certification number must be provided. However, given the current China's actual operation situation, CQC for ccL data passing through the UL certification as a reference. Company at the time of applying for cQc, along with all the will of base material uL certification and cQc certification. If the base material didn't pass any certification, so, must be CQC certification or random test base material.
4, basic application CQC certification process?
Answer: (1) on the cQc website complete qualified application materials. Note: PCB product categories are: non-metallic materials and components performance logo certification (134 kinds) printed circuit board in small classes (134001);
(2) the CQC product certification engineer for data review, cell division, is expected to deliver and test quotation, order to notice;
(3) the enterprise according to the requirements of standard sample preparation and CQC authorization to the lab for testing; At the same time, please pay;
(4)Circuit boards test result after testing organizations will report to China quality certification center;

PCB Common Query (2)

Thickness
1. Lay-up
In DWG, customer mentioned layer order only, but didn’t indicate the dielectric thickness between layers and Copper thickness. So, we suggest you follow the lay-up shown on attached file XX, Please confirm.

2. Mismatch between the lay-up and board thickness
According to the lay-up specified by customer, the overall board thickness will be XXX mil, not the customer nominal requirement of YYY mil. So, we suggest:
A). To follow the lay-up specified by customer and change the overall Rigid-flex pcb thickness to YYY mil +/-10%
B). To modify the lay-up as shown on attached file and control the overall board thickness to be XXX mil per customer requirement.
Please clarify which item (A or B) customer preferred.

3. Relax board thickness tolerance.
Customer required controlling the finished board thickness to be XX%, however, the standard tolerance for board thickness is +/-10%. We can achieve tighter tolerance by ordering non-standard materials; however, it will take a long lead-time and a high price to purchase this special material. So, we suggest you relax the tolerance from XX% to +/-10%. Please confirm.

Cu thickness & Pad
1. Add Cu clearance for NPTH or consider 2nd-drill
The non-plated hole located in ground plane(OR a large pad: DIAXXX), in order to facilitate in production, we suggest we shave Cu and add a 10mil clearance around non-plated holes. Please confirm.

2. Add dummy pattern
As the distribution of Cu pattern is very uneven on outer layers, in order to balance plating and improve quality, we suggest you add some dummy pattern in blank area. The dummy shape and size see attached file. Please confirm.

3. Copper close to board edge
In some locations, copper features are closer than 15mil(10mil) from the outline. This presents the risk of exposed copper at board edges. We suggest we shave copper to get sufficient spacing. Please confirm.

4. Copper extending to unit edge
In some locations, copper has extended to unit edge. If we follow master A/W to build, copper will be exposed at unit edge. So, we suggest we shave copper to get sufficient spacing. Please confirm.

5. Delete NPTH pad
For some non-plated holes(DIA: XX), their pad size(DIA: XXX) is larger than hole size. In order to facilitate in production, we suggest you delete these pads. Please confirm.

6. Distance between two pads less than 4mil
On component side/solder side, the spacing between two pads is too narrow (X mil only). As the two pads have been connected together in inner layer YY. In order to facilitate in production, we suggest we shave the pads and keep 5mil spacing. Please confirm.

7. Pad size is too small
According to master A/W the via hole pad is too small (hole size: MMM, pad size: NNN). As there isn’t enough spacing for us to enlarge these pads. In order to select a smaller drill we suggest you change the tolerance of via hole from XXXX+/-3mil to XXXX+0/-6mil. Please confirm.

8. PTH hole with elliptic pad
Per master artwork, we found some PTH holes (DIA: XXX mil) with elliptic pad (pad size: MM X NN mil) (see attached file).AS the elliptic pad was too small, thus it was ineluctable that hole will be broken on short side if we follow master artwork to proceed We suggest to enlarge the pad suitably to guarantee a 2 mil (min)annular ring on the conjoint area, please confirm.

PCB Prototype Assembly Services

The evolution of our world's technology is truly astounding. In the past decades, we've made great leaps and bounds in terms of what our electronic devices are capable of accomplishing, and things are only getting better. Technological engineers and electronics designers are continuously dreaming up new ways to improve existing products, as well as completely original ideas for simplifying everyday life and tasks. But how does this process occur, exactly?

Every bit of technology - from the smallest, consumer electronic gadget to complex healthcare and aerospace units - begins with an idea. From here, plans can be made to develop a working prototype in order to test the capabilities of the device and to determine whether the idea is worth investing in, or how it can be further expounded upon in order to make it more operable, functional, and efficient. Every step in designing and assembling the prototype is essential to enabling the simple dream to become a reality. To give you a better idea of the process, this post will walk you through the life cycle of a prototype.

The Idea Phase
At this point, you or one of your clients may have a thought for how to improve an existing unit or device, or for creating something brand new. Here, you discuss what the PC board should be able to accomplish, what the functions of the device should be, and the sizing requirements for the unit and, therefore, for the board.

The Design Phase
Once you have a good idea but any size constraints for the board and know what it is that you want to be able to do with it, you can begin actually planning and designing the schematics for the PCB development for the prototype. You'll need to consider the necessary components for achieving your objectives, and how these will factor into the layering and thickness of the board, as well as any budgetary concerns.

The PCBA manufacturer Phase
After the design schematics have been tested out and approved, the board is ready to be assembled for the working prototype. In order to ensure that the PCB will be functional, efficient, and effective, it's important that all settings are properly calibrated (for automated processing), and that the use of the most advanced equipment is utilized so that every component is laid out and connected with the utmost precision, while still maintaining speed.

The Testing Phase
After the board has been assembled, it will need to be subjected to testing. First, you or your contract manufacturer will need to analyze the PCB to ensure that it's actually functioning in accordance with the client's specifications and the design schematics that were previously drawn up. Any inconsistencies or errors will need to be troubleshooted and addressed before the board is presented to the client. From here, the client may want to run their own set of tests, and actually test out the use and functionality of the device as a working whole before making a decision about ordering a larger batch.

The Adjustment Phase
After testing out the initial prototype, you or your client may notice certain areas that could be improved upon, which would make the end product more efficient and effective. After making not of these areas, you may need to go back to the original specs and make some adjustments before mass assembling the final PC boards.

A Never Ending Cycle
Even after a prototype has been approved for mass production and has made its way to the end user, its evolutionary cycle is never actually complete. As technology advances, it will be discovered that the existing device can be improved upon, or even eventually replaced, by something better, but that's what makes the world of technology so exciting! As long as dreamers are coming up with new ideas, we'll be ready to take on the challenge of developing prototypes that may end up changing the world.