Aluminum board process-B

5.4 board inspection
5.4.1 line surface must be in accordance with the requirements of the MI to check all the content.
5.4.2 must check on aluminum surface, aluminum surface dry film cannot have film falls and broken.
5.5 etching
5.5.1 for copper base is commonly 4 oz, will there is a certain difficulty in etching.First plate must be approved by the captain in person to do board, made in the spot check, line width, line spacing should be strengthened once every 10 PNL plate spot check line width, and make records.
5.5.2 recommended parameters: speed: 7 ~ 11 dm/min pressure: 2.5 kg/cm2 proportion: 25 be temperature: 55 ℃ (the above parameters are for reference only, the test plate results shall prevail)
5.5.3 back membrane should be paid attention to the time of the control between 4 ~ 6 min, because aluminium will reaction with NaOH, but also must ensure that the membrane clean, backing down membrane liquid membrane was not allowed to turn up the heat.No protective film of the plate, aluminum, from liquid membrane in the back up after the board will not stay to wash water on a board in time of liquid membrane, prevent the alkali corrosion of aluminum pcb surface.  
5.6 corrosion inspection
5.6.1 normal board.
5.6.2 it is forbidden to use the blade repair line, in order to avoid injury and dielectric layer.
5.7 the solder mask
5.7.1 production process:
Brush copper surface grinding plate (only) to screen printing green oil (the first), and preliminary drying screen printing green oil (second) and the preliminary drying - exposure and development - plate mill, the acid pickling process. Under the soft brush - after curing -
5.7.2 reference parameters:
5.7.2.1 yarn used 36 t + 100 t
First 75 ℃ 5.7.2.2 x 20-30 min;The second 75 ℃ x 20-30 min
5.7.2.3 exposure: 60/65 (single) 9 ~ 11
5.7.2.4 enhancement: speed: 1.6 ~ 1.8 m/min pressure: 3.0 kg/m2 (total pressure)
5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.   
5.8 HASL
5.8.1 spray before tin for aluminum plate with protective film tear protective film after spray tin.    
5.8.2 edge with both hands, it is strictly prohibited by hand directly touch the plate (especially aluminum surface).
5.8.3 operation, fight chafed.
5.8.4 tin cookie sheet before 130 ℃, 1 hour, and baking sheet to spray tin interval time less than 10 minutes.In order to avoid temperature difference cause a layered with ink.    
5.8.5 rework plate spray is only allowed to return once, if more than one board, to distinguish for special treatment.    
5.9 aluminum surface passivation treatment
5.9.1 level passivation process: (1) scrubbing brush (500 #) to (2) water - > (3) passivation, (4) washing the x 3-5. Dry - 6 drying
Note: (1) grinding plate: only aluminum surface grinding, FR4 parameter grinding plate.First board to check line no scratches, as well as the tin cried, uniform grinding crack.
(3)passivation: potion ingredients open cylinder quantity cylinder volume liquid temperature control concentration spraying in tank pressurization rate
Na2CO3 (CP) 50 g / 6500 g l, 130 l, 40 ~ 50 ℃ 2.0 ~ 3.0 1.0 ~ 1.5 m/min effective soaking time 10 ~ 15 s 100 m2 CP (K2CrO4) 15 g/l,  1950 g NaOH (CP) 390 g, 3 g/l
6 drying: 80 ~ 90 ℃.
Tyle = "the oledata.mso - spacerun: 'yes', the font size: 10.5000 pt; the font-family:" tahoma "; "> 5.7.2.5 curing: after 90 ℃ * 60 min + 60 min + 110 ℃ 150 ℃ above x 60 min parameters for the use of the DSR - 2200 tl ink, used only for reference.
5.7.3 note printing for control of air bubbles, if need, can add 1-2% of the diluent.   
5.7.4 clappers before clappers member should check panel, there is a problem of instruct the captain and then to the clapper.  

PCB, CCL application CQC authentication problem solving-（2）---Wonderful PCB (hk) Limited

(5) China quality certification center after receiving the test results, according to the requirements of relevant procedure contact the applicant for factory inspection for the first time (if already held CQC certification, and effective certificate does not need to factory inspection) for the first time.
6 China quality certification center, after receipt of the sample test report and factory inspection report. Enterprise certification fee. After evaluation of qualified product certification certificate.
5, the new measures, the factory to supervise and inspect the frequency change? What are the specific requirements of factory inspection?
Answer: on May 16, 2008, the revision (CQC logo certification of special rules, the factory to supervise and inspect the amended by once a year to once every quarter; for the specific requirements of the factory inspection can view the CQC logo certification of special rules annex 7 requirements of factory quality assurance ability.
6 what are the main cost, application CQC?
A: in general, is the cost of main application CQC: application fee: 600 yuan/zhang, approved registration fee: RMB 1000 / sheet; : please according to the requirements of the enterprise application project, category, such as case, determine the bid; As defined by the scale of factory factory inspection fee for the first time: (RMB 3000 / per person). The final payment by CQC notice shall prevail.
7, application considerations of CQC standard sample production?

Dear my friend,
We will attend AsiaWorld-Expo Apr.11-14th and OCT.11-14th 2015. We sincerely invite you

to attend it with us together. Hope we can meet you in Hongkong soon.
Booth Number: 9C27/ 9G24
Time: Apr.11-14th and OCT.11-14th, 2015
Address: AsiaWorld-Expo in Hong Kong
http://www.wonderfulpcb.com/
                                        Wonderful PCB (HK) Limited

WonderfuI Printed Circuit Board

    Flying Probe Tester is a test PCB manufacturing environment system. Instead of using the conventional on-line testing machine all conventional needle bed (bed-of-nails) interface, flying probe test uses four to eight independent control of the probe, is moved to the test element. In the measurement unit (UUT, unit under test) supplied to the testing machine by a belt or other transmission system UUT. Followed by fixing the probe tester to test pad (test pad) and a via hole (via) was tested for in a single element measuring means (UUT) is. Test probe connected via multiplexing (multiplexing) to the drive system (signal generator, power supply, etc.) and sensor (DMM, frequency counter, etc.) to the test element on the UUT. When a component is being tested, and other components on the UUT through the probe electrically shielded to prevent interference readings (Figure 1).
    Flying Probe Tester can check the short circuit, open circuit and component values. On the flying probe test also uses a camera to help locate the missing elements. With a camera to check the direction clear element shapes, such as polar capacitors. With the probe positioning accuracy and repeatability reach 5-15 micron range, flying probe tester can accurately detect UUT.
    Flying Probe Test solve a lot of the current problems in PCB assembly to see, such as the lack of a model in the development of gold (golden standard board). Problems may take up to 4-6 weeks also includes test development cycle; about $ 10,000- $ 50,000 a fixture development costs; not less economically test production; and the inability to quickly test the prototype (prototype) assembly. These cases illustrate, the traditional test-bed tester lack of low cost production system; lack of a quick test prototype assembly cover; and can not test to shield assembly.
    Because the ability to have close contact with the UUT shielding ability and help reach the market faster (time-to-market), the flying probe test is an invaluable resource production. Further, since no test development engineer experienced, the system can be considered as having the added value of savings in equipment and time savings and other benefits of manpower.

Sophie Deng
_______________________________________
Wonderful PCB Limited
NO.32A,Building NO.1, XianDaiC hengHuaTing,ChuangYeRoad|NanShan District,ShenZhen City 518054|  China  T +86-755-86229518-806 | F  +86 755 2607 3529|  e  wonderful08@wonderfulpcb.com |
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Welcome to our trading shows:
1.Booth: L32,Expo Electronic 2013,Apr.10-12th in CROCUS EXPO,Moscow,Russia
2.Booth: 11J36, HK Global sources  Apr.12-15th, 2013 Asia World-Expo, Hong Kong
3.Booth: 9J35, HK Global sources Oct.12-15th,2013 Asia World-Expo, Hong Kong
4.Booth: 70206, CES  2014  Jan,8th-11th in Las Vegas, USA

PCB Assembly Introduction

There are two process for manufacturer to do PCB assembly.
Below picture show controle base plate(PCBA) exist everywhere in our house appliances. 
Process of PCB assembly fabrication
(1) . Traditional DIP process
(2) . SMT process

Here first is the introduction of the process of DIP today.
1 . Traditional DIP process to Flexible pcb assembly means inserting the parts which with leg into the PTH hole of PCB.
2 . And then pass the PCB through tin soldering machine, to reach the purpose of soldering tin.                               

The structure of tin soldering machine

The structure of flux tank


The function of foamed pipe in flux tank
1. To air through the tiny holes on the foam tube body, causing numerous of air bubbles, with the number of air bubbles to cleave with flux, by metal accumulation, contact from the bottom of the base board and achieve the function of the flux coating, and then extra flux be strike off by air knife, and make flux distributed uniformly at the bottom of the base plate.

Method of flux coating
1. Bubble type flux coating
2. Wave type flux coating
3. Spray type flux coating

Hello I also would like to make simple introduction on flux which is used for assembly

A. The function of Flux
1. Remove the oxide on the surface of part and substrate
2.Reduce the surface tension of the solder and promote the flow of the solder
3.To protect the surface of the metal, avoid it to be oxidized under the environment of high temperature.

B. The main ingredients of flux
1.Rosin: it is refined from the grease of pine tree.
2.surfactant : Because of the gentle characteristics of rosin, it is not easy to remove the oxide, thus must add surfactant in order to enhance its effect.
3. Solvent: Dissolve and blend solid state material like rosin and surfactant, general multi-purpose isopropyl alcohol or ethylene glycol.
4. In addition, there are interface active agent, foaming agent and other ingredients

C. Variety of flux.
(1) Rosin flux :
1. R grade : Inactive rosin flux
2 . RMA : Weak activity rosin flux
3 . RA : Strong activity of rosin flux
4 . RSA : Super Strong activity of rosin flux

(2) Synthesis of active flux : This kind of flux is developed by DUPONT company, it’s advantage is can make the residue which caused after soldering can become liquid state, easily for cleaning.
Based on activity, it can be divided into: 
SR–No active synthetic flux
SMAR – Weak active synthetic flux
SSAR – Strong active synthetic flux
SAR – Super strong active synthetic flux

(3). Water-soluble flux: The flux of organic acids, performs best help on welding, but must pay attention to the cleaning situation of the base board of welding after washing. If there’s residues, it will cause corrosion of substrate material, military and aerospace industry are banning the use of water-soluble flux process of substrate

(4). Disposable flux
Rosin kind improved flux: solid content 5-20%, residues will not cause corrosion to the base plate.

Low content of solid flux: solid content at 5%,  disposable flux disposable because its residue in the residues of substrate could not cause corrosion of substrate, but solid content in about 5% of